Your cart is empty.
Your cart is empty.Product Description
- Features: It has heat conducting properties, strong adhesion.
- Suitable for all heatsink without fixed clip.
- Helps disperse the heat from Chipset to heatsink effectively.
- Do not use thermal glue between CPU and HEATSINK.
- The curing rateis related to the relative humidity and temperature in the air, the higher the temperature, the faster the curing speed, and vice versa.
- Recommended coating thickness: 0.1-0.5mm, the thinner the better.
- Please close the lid immediately after use to prevent the glue from curing.
Safety Application
Non-electrical conductive,non-volatile, flame retardant, which eliminates the risk of short circuit and discharges and corrosion damage to the chip and the radiator.
Long-lasting and stable performance
Excellent ease of use and outstanding long-term stability.
Wide working temperature
Wide working temperature: -60℃ ~ 280℃ (-76℉ to 536℉)
Wide range of applications
Use for MOSFET, LED, heat sinks , North-south bridge, graphics card , Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.
Recommended Products