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Features:
It has high strength and fast bonding effect.
Used to heat sink with IC chips,and be cooling body with good thermal effect.
It is a one-component room temperature vulcanized gel with good thermal conductivity and insulation. It has good conductivity, wide temperature (-60~200°C) and short-term resistance to 300°C.
In addition, it has short curing for time, strong bonding force, long storage period, non-toxic, solvent-free.
It can be safely applied in the elastic bonding, heat dissipation, insulation and packaging of electronics, electrical appliances, instruments, LEDs, heat sinks and other industries.
Instructions:
1. When using, directly extrude the product, rub the of the adherend, and it immediately after use, in for case of trial again;
2. The fixed speed is related to the relative humidity and temperature in the air; the the temperature, the faster the curing speed, and ;
3. the recommended thickness of the application: 0.1-0.5mm, the thinner the better.
4. Please the of the bonded object before use (such as ), avoid with detergent, and apply it after the is .
Specification:
Thermal conductivity: >0.671W/for m.k
Breaking strength: 1.5MPA
vulcanization time: 10Min/25°C
Silicone
Capacity:
Length: 52mm/2.05inch
Color: As shown
Quantity: 1 Pc
Note:
1.Please allow 0-1cm error due to manual measurement. pls make sure you do not mind before you bid.
2.Due to the difference between different monitors, the picture may not reflect the actual color of the item. Thank you!
Package includes:
1 x Thermal Silicone Adhesive
